[專題演講]2019/03/22 (五)AI and Intelligent IC Design/Manufacutring
AI and Intelligent IC Design/Manufacutring
Speaker : Prof. David Z. Pan (University of Texas at Austin)
Date : 2019/03/22 (Fri.)
Time : 14:50
Location :R615, Delta Bldg.
Host : Prof. Tsung-Yi Ho
Abstract
Artificial intelligence (AI) studies the theory and development of computing systems able to learn, reason, act and adapt. Integrated circuit (ICs), powered by the semiconductor technology, enable all modern computing systems with incredible level of integration, e.g., a small chip (<1cm2) nowadays can integrate billions of transistors. As the semiconductor technology enters the era of extreme scaling (1x nm), IC design and manufacturing complexities are extremely high. Intelligent cross-layer design and manufacturing co-optimizations are in critical demand for better performance, power, manufacturability, reliability, security, time-to-market, and so on. This talk will discuss the synergy between modern AI technologies (e.g., machine learning) with intelligent deep-nanoscale IC design and manufacturing. Several case studies will be presented on AI for IC, including advanced lithography modeling, hotspot detection, mask synthesis, physical design, and security. Meanwhile, customized IC for AI can further improve the training and inference performance-energy efficiency by orders of magnitude. Thus, the co-evolution of AI algorithms and IC technologies shall be investigated jointly to advance each other.
Biography
David Z. Pan (IEEE Fellow, SPIE Fellow) received his BS degree from Peking University and MS/PhD degrees from UCLA. He is currently a full professor and holder of the Engineering Foundation Endowed Professorship #1 at the Department of Electrical and Computer Engineering, The University of Texas at Austin. His research interests include cross-layer IC design for manufacturing, reliability, security, machine learning in EDA, hardware acceleration, and CAD for analog/mixed signal designs and emerging technologies. He has published over 350 refereed journal/conference papers and 8 US patents. He has served in many journal editorial boards and conference committees, including various leadership roles. He has received many awards, including SRC Technical Excellence Award, 16 Best Paper Awards, DAC Top 10 Author Award in Fifth Decade, ASP-DAC Frequently Cited Author Award, Communications of ACM Research Highlights, ACM/SIGDA Outstanding New Faculty Award, NSF CAREER Award, IBM Faculty Award (4 times), UCLA Engineering Distinguished Young Alumnus Award, UT Austin RAISE Faculty Excellence Award, and many international CAD contest awards, among others. His students have also won many awards, including the First Place of ACM Student Research Competition Grand Finals in 2018, ACM/SIGDA Student Research Competition Gold Medal (twice), ACM Outstanding PhD Dissertation in EDA (twice), EDAA Outstanding Dissertation Award (twice), and so on.
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