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[專題演講]8/28(三) Through-Silicon-Via Devices and Circuits for Submillimeter Scale Sensing

國立清華大學資訊工程學系

Department of Computer Science

National Tsing Hua University

專題演講

SEMINAR

SPEAKER

主講人:Prof.Umamaheswara Rao Tida 

   TOPIC   

題 目:Through-Silicon-Via Devices and Circuits for Submillimeter Scale Sensing  

DATE

時  間: 108年08月28日(三)下午2點至3點30

PLACE

地 點:台達館525

Abstract:

Big Data is becoming an integral part of every sector. But in some sectors, critical data is never easy to collect. In this talk, I will discuss challenges on the design of submillimeter scale sensors needed for geo-data mining, which is of critical importance to applications such as geothermal utilization, soil liquefaction and quick sand. The functional complexity and tight area budget for submillimeter scale sensors are hard to satisfy using any existing design schemes. Towards this, I will present a novel framework, derived from three-dimensional integrated systems that may come to rescue. It is based on our interesting discovery that idle through-silicon-vias (TSVs) can in fact be made as ultra-compact devices. An example will be given on the TSV inductor and its application to area-hungry DC-DC converters and resonant clocking. Experiments on product-level designs verify that significant area reduction can be achieved with almost no loss in performance. Finally, I will briefly discuss my other research directions, including VLSI design for implantable biosensors and neuromorphic computing.

聯絡人:王俊堯 教授

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